View MAX8546EUB_327354.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MAX8546EUB Rev. A
RELIABILITY REPORT FOR MAX8546EUB PLASTIC ENCAPSULATED DEVICES
August 9, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX8546 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information V. ........Quality Assurance Information VI. .......Reliability Evaluation IV. .......Die Information .....Attachments
I. Device Description A. General The MAX8546 is a voltage-mode pulse-width-modulated (PWM), step-down DC-DC controller ideal for a variety of cost-sensitive applications. It drives low-cost N-channel MOSFETs for both the high-side switch and synchronous rectifier, and require no external current-sense resistor. This device can supply output voltages as low as 0.8V. The MAX8546 has a wide 2.7V to 28V input range, and does not need any additional bias voltage. The output voltage can be precisely regulated from 0.8V to 0.83 x VIN. This devices can provide efficiency up to 95%. Lossless shortcircuit and current-limit protection is provided by monitoring the RDS(ON) of the low-side MOSFET. The MAX8546 has a current-limit threshold of 165mV. The device features foldback-current capability to minimize power dissipation under short-circuit condition. Pulling the COMP/EN pin low with an open-collector or low-capacitance, open-drain device can shut down the device. The MAX8546 operates at 300kHz. The MAX8546 is compatible with low-cost aluminum electrolytic capacitors. Input undervoltage lockout prevents proper operation under power-sag operations to prevent external MOSFETs from overheating. Internal soft-start is included to reduce inrush current. This device is offered in space-saving 10-pin MAX packages.
B. Absolute Maximum Ratings Item (All voltages referenced to GND unless otherwise noted.) VIN to GND VCC to GND FB to GND BST to GND VL, DL, COMP to GND BST to LX DH to LX VL Short to GND LX to GND Input Current (any pin) Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature (soldering, 10s) Continuous Power Dissipation (TA = +70C) 10-Pin MAX Derates above +70C 10-Pin MAX
Rating
-0.3V to +30V -0.3V, lower of 6V or (VL + 0.3V) -0.3V to +6V -0.3V to +36V -0.3V to (VCC + 0.3V) -0.3V to +6V -0.3V to (VBST + 0.3V) 5s 0 to 30V 50mA -40C to +85C +150C -65C to +150C +300C 444mW 5.6mW/C
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Low-Cost, Wide Input Range, Step-Down Controllers with Foldback Current Limit B8 (Standard 0.8 micron silicon gate CMOS) 3007 California, USA Thailand, Philippines or Malaysia July, 2003
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard JESD22-112: 10-Pin MAX Copper Solder Plate Silver-Filled Epoxy Gold (1.0 mil dia.) Epoxy with silica filler # 05-3501-0016 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 58 x 72 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.8 microns (as drawn) 0.8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Opertions) Bryan Preeshl (Executive Director of QA) Kenneth Huening (Vice President) 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects.
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4389 x 125 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV = 8.69 x 10-9 = 8.69 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-5856) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The PM32-4 die type has been found to have all pins able to withstand a transient pulse of 400V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results MAX8546EUB TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES
PACKAGE
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
125
0
DC Parameters & functionality
uMAX
77
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters & functionality 77 0
Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
TERMINAL D Mil Std 883D Method 3015.7 Notice 8
ONCE PER SOCKET
ONCE PER BOARD
5 OHMS
+15V
17 K
1 10
1 uF
2 9
3
8
1 uF
8K
4 7
5
6
1 uF
0.1 uF
10 PIN uMAX
DEVICES: MAX1967EUB MAX. EXPECTED CURRENT = 20mA
DOCUMENT I.D. 06-5856 REVISION A
DRAWN BY: TEK TAN NOTES:
MAXIM
TITLE: BI
Circuit (MAX1967EUB)
PAGE
2
OF 3

▲Up To Search▲

Price & Availability of MAX8546EUB

	To Download MAX8546EUB Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .